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? 2002 microchip technology inc. ds21377b-page 1 tc1266 features ? glitch free transition between input sources automatic input source selection external pmos bypass switch control built-in 5v detector 1% regulated output voltage accuracy 200ma load current capability kelvin sense input low dropout voltage (240mv @ full load) low ground current, independent of load applications pcmcia pci network interface cards (nics) cardbus tm technology device selection table package type general description the tc1266 is an application-specific, low dropout regulator (ldo), specifically intended for use in pci peripheral card applications complying with pci power management (pci 2.0). it provides an uninterrupted, 3.3v, 200ma (max) output voltage when the main (5v) or auxiliary (3.3v) input voltage supplies are present. thetc1266consistsofanldo,avoltagethreshold detector, external switchover logic and gate drive circuitry. it functions as a conventional ldo as long as the voltage on the main supply input (v in ) is above the lower threshold (3.90v typical). should the voltage on v in fall below the lower threshold, the ldo is disabled and an external p-channel mosfet is automatically turned on, connecting the auxiliary supply input to v out, and ensuring an uninterrupted 3.3v output. the main supply is automatically selected, if both the main and auxiliary input supplies are present, and transition from one input supply to the other is ensured glitch- free. high integration, automatic secondary supply switchover, kelvin sensing, and small size make the tc1266 the optimum ldo for pci 2.0 applications. functional block diagram part number package junction temp. range TC1266VOA 8-pin soic (narrow) -5c to +125c tc1266vua 8-pin msop -5c to +125c 1 2 3 4 8 7 6 5 t c 12 66 sense v out nc 8 -pin so i c n c v a ux g n d v in d r 1 2 3 4 8 7 6 5 t c 12 66 8 -pin m sop n c v a ux g n d v in sense v out nc d r + ? v in v aux gnd d r v out sense bandgap reference detect e/a 200ma pci ldo
tc1266 ds21377b-page 2 ? 2002 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings* input supply voltage (v in ).............. -0.5v to +7v (max) auxiliary supply voltage (v aux ) .....-0.5v to +7v (max) ldo output current (i out )................................ 200ma thermal impedance, junction-to-ambient ( ja )............130c/w for soic esd rating .......................................................... 2 kv operating temperature range (t a )........-5c to +70c storage temperature range (t stg ) ...-65c to +150c *stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. tc1266 electrical specifications electrical characteristics: t a = +25c, v in =5v,v aux =3.3v,i out =0.1ma,c out =4.7 f, unless otherwise noted. boldface type specifications apply over full operating temperature range. symbol parameter min typ max units test conditions v in supply voltage 4.3 5.0 5.5 vv aux =0v i gnd ground current ? ? 230 260 450 500 av aux =0v (note 6) v aux =3.3v (note 6) i vin reverse leakage from v aux ?-0.1 -1.0 av aux =3.6v,v in =0v,i out =0ma v aux supply voltage 3.0 3.3 3.6 v i q(aux) quiescent current ? ? 50 ? 70 100 av in =0v,i out =0ma ? ? 60 ? 80 120 av in =5v,i out =0ma i vaux reverse leakage from v in ?-0.1 -1.0 av in =5,5v,v aux =0v,i out =0ma v th(lo) 5v detector low threshold voltage ? 3.75 3.90 ? ? 4.05 vv in falling (notes 2, 3) v hyst 5v detector hysteresis voltage ? 200 260 ? ? 300 mv (notes 2, 3) v th(hi) 5v detector high threshold voltage ? 4.0 4.15 ? ? 4.30 vv in rising (notes 2, 3) v out ldo output voltage ? 3.300 ? v i out =20ma 3.234 ? 3.366 4.3v v in 5.5v, 0ma i out 200ma 3.000 ? ? 3.75v v in 4.3 v, 0ma i out 200ma (note 4) i out output current 200 ? ? ma reg (line) line regulation ? -0.5 0.05 ? ? 0.5 %v in = 4.3v to 5.5v reg (load) load regulation ? -0.5 0.05 ? ? 0.5 %i out = 0.1ma to 200ma note 1: ensured by design. 2: see 5v detect thresholds, figure 4-1. 3: recommended source impedance for 5v supply: 0.25 ? . this will ensure that i out xr source ? 2002 microchip technology inc. ds21377b-page 3 tc1266 tc1266 electrical specifications (continued) electrical characteristics: t a = +25c, v in =5v,v aux =3.3v,i out =0.1ma,c out =4.7 f, unless otherwise noted. boldface type specifications apply over full operating temperature range. symbol parameter min typ max units test conditions v dr drive voltage v in -0.2 v in -0.3 v in -0.1 ? ? ? v4.3v v in 5.5v, i dr =200 a ? ? 35 ? 150 200 mv v in tc1266 ds21377b-page 4 ? 2002 microchip technology inc. 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table 3.0 detailed description figure 3-1: application circuit pin no. (8-pin soic) (8-pin msop) symbol description 1v in main input supply for the tc1266, nominally 5v. 2 nc not connected. 3v aux auxiliary input supply, nominally 3.3v. 4 gnd logic and power ground. 5 nc not connected. 6 sense sense pin for v out .connecttov out attheloadtominimizevoltagedropacrosspcbtraces. 7v out ldo 3.3v output. 8d r driver output for external p-channel mosfet pass element. v in nc v aux gnd nc sense v out d r u1 tc1266 1 2 3 4 5 6 7 8 note: external switch (q1): use motorola mgsf1p02elt1 or equivalent (pmos, typical gate threshold voltage = 1v, typical r ds(on) = 0.4 ? at vgs = 2.5v) 5v 3.3v q1 c1 0.1 f c2 4.7 f c3 0.1 f c4 4.7 f c5 0.1 f 3.3v
? 2002 microchip technology inc. ds21377b-page 5 tc1266 4.0 thermal considerations 4.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 4.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation (equation 4-2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ja ). equation 4-2: equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: given: v in max =5v5% v out min =3.217v i load max = 200ma t j max = 125c t a max =70c ja = 130c/w (soic) find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d (v in max ?v out min )i load max = (5.25v - 3.217v) 200ma = 407mw maximum allowable power dissipation: in this example, the tc1266 dissipates a maximum of 407mw; below the allowable limit of 423mw. where: p d (v in max ?v out min )i load max p d v in max v out min i load max = worst case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d max =(t j max ?t a max ) ja where all terms are previously defined. p d max =(t j max ?t a max ) ja = (125 ? 70) 130 = 423mw
tc1266 ds21377b-page 6 ? 2002 microchip technology inc. figure 4-1: 5v detect threshold figure 4-2: timing diagram note: v in rise and fall times (10% to 90%) to be 100 sec. d r v in 3.65v 2.0v 4.4v 2.0v v th(hi) v hyst v th(lo) d r v in 2.0v 4.4v 2.0v note: v in rise and fall times (10% to 90%) to be 0.1 sec. 3.65v t dh t dl
? 2002 microchip technology inc. ds21377b-page 7 tc1266 5.0 typical characteristics note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q vs. v in vs. junction temperature 012 34 5 6 v in (v) i q (ma) i o = 0.1ma v aux = 0v +125 c +25 c -5 c 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q (aux) vs. v aux vs. junction temperature 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 v aux (v) i q (aux) (ma) i o = 0ma v aux = 0v +125 c +25 c -5 c 3.34 3.33 3.32 3.31 3.30 3.29 3.28 3.27 3.26 ldo output voltage vs. junction temperature -50 -25 0 25 50 75 100 125 v out (v) i o = 200ma v in = 5v junction temperature c i q vs. v in vs. junction temperature 0 1234 56 v in (v) 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q (ma) i o = 0.1ma v aux = 3.3v +125 c +25 c -5 c 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q (aux) vs. v aux vs. junction temperature 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 v aux (v) i q (aux) (ma) i o = 0ma v aux = 5v +125 c +25 c -5 c
tc1266 ds21377b-page 8 ? 2002 microchip technology inc. 5.0 typical characteristics (continued) t r ace 1 : v in stepp i n g f or 0 . 8v to 5v tr ace 2: d r th ( hi ) tdh = < 4 s dr i ve h ig h dela y see application circuit on pa g e 5 i l o a d = 2 00 m a v in ste p s from 0.8v to 5 v trace 1: v in ? 3a charging a 1500 f capacitor trace 2: d r going high at v th(hi) trace 3: v out , offset 3.3v. v out(min) = 3.24v i load = 200 a v o (min) with v in rising notice no voltage spikes during transition from v aux to ldo output v out voltage difference is i out x r ds(on) and variations between v aux supply and ldo output voltage tr ace 1: v in stepp i n g f or 5.5v to 0 v r tdl = < 600n s dr i ve low dela y trace 1: v in ? discharging a 1500 f capacitor trace 2: d r going low at v th(lo) trace 3: v out , offset 3.3v. v out(min) = 3.14v i load = 200 a v o (min) with v in falling v out voltage difference is i out x r ds(on) + voltage difference from ldo to v aux supply
? 2002 microchip technology inc. ds21377b-page 9 tc1266 5.0 typical characteristics (continued) load response rising edge see application circuit on page 5 v out ac 60mv/div i load = 3ma i load = 200ma load response falling edge 4 see application circuit on page 5 i load = 3ma i load = 200ma
tc1266 ds21377b-page 10 ? 2002 microchip technology inc. 6.0 packaging information 6.1 package marking information package marking data not available at this time. 6.2 taping form component taping orientation for 8-pin msop devices package carrier width (w) pitch (p) part per full reel reel size 8-pin msop 12 mm 8 mm 2500 13 in carrier tape, number of components per reel and reel size pin 1 user direction of feed standard reel component orientation for tr suffix device w p component taping orientation for 8-pin soic (narrow) devices package carrier width (w) pitch (p) part per full reel reel size 8-pin soic (n) 12 mm 8 mm 2500 13 in carrier tape, number of components per reel and reel size standard reel component orientation for tr suffix device pin 1 user direction of feed p w
? 2002 microchip technology inc. ds21377b-page 11 tc1266 6.3 package dimensions 8-pin msop .122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) max. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6 max. .026 (0.65) typ. pin 1 dimensions: inches (mm) .050 ( 1.27 ) typ . 8 8 -pin so i c dimensions: inches (mm)
tc1266 ds21377b-page 12 ? 2002 microchip technology inc. notes:
? 2002 microchip technology inc. ds21377b-page 13 tc1266 sales and support data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc1266 ds21377b-page 14 ? 2002 microchip technology inc. notes:
? 2002 microchip technology inc. ds21377b-page 15 tc1266 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical com- ponents in life support systems is not authorized except with express written approval by microchip. no licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, filterlab, k ee l oq ,microid, mplab,pic,picmicro,picmaster, picstart, pro mate, seeval and the embedded control solutions company are registered trademarks of microchip tech- nology incorporated in the u.s.a. and other countries. dspic, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, mxdev, mxlab, picc, picdem, picdem.net, rfpic, select mode and total endurance are trademarks of microchip technology incorporated in the u.s.a. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2002, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.
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